ShanHong Technology has launched a new precision customized semiconductor heat spreader service, offering precise designs in various styles, substrates, and specifications to ensure every product achieves optimal thermal dissipation performance, meeting the demands of the high-performance semiconductor industry. This service provides the most suitable heat spreader design solutions based on the client's product characteristics and application scenarios.
The new generation of customized heat spreaders utilizes high-precision Electroless Nickel Plating technology, which enhances surface uniformity, reduces thermal contact resistance, and further strengthens thermal dissipation performance.
Currently, this customized service has been adopted by multiple semiconductor equipment manufacturers. In the future, ShanHong Technology will continue to cooperate with industry partners to promote more innovative thermal dissipation solutions, meeting the market demand for high-performance chip cooling.
*Additional information:
Soft Material
Characteristics:
• The metal is relatively soft, highly malleable, and suitable for deep processing or precision manufacturing.
• Features better thermal conductivity, capable of rapidly and uniformly distributing heat.
• May include pure copper (such as C1100 Red Copper) or certain low-hardness aluminum alloys.
Applications:
• Semiconductor Heat Spreaders (suitable for high-efficiency thermal dissipation requirements)
• Thermal Conduction Modules for Electronic Components
• Precision Stamped Parts
Hard Material
Characteristics:
• Higher strength and wear resistance, suitable for applications subject to mechanical stress.
• Lower ductility compared to soft materials, leading to higher processing difficulty.
• May include hard copper alloys (such as C2600 Brass) or hardened stainless steel.
Applications:
• High-durability Electronic Structural Components
• High-strength Support Materials (e.g., connectors, lead frames)
• Fixing Jigs for Semiconductor Equipment
紅銅料（Red Copper Material）
Characteristics:
• Red Copper (Pure Copper C1100) has a copper content of up to 99.9%, offering excellent electrical and thermal conductivity.
• The material is soft and highly ductile, suitable for manufacturing thin heat spreaders or high-conductivity components.
• Easily oxidized; typically undergoes Electroless Nickel Plating to prevent oxidation and corrosion.
Applications:
• Semiconductor Heat Spreaders (high thermal conductivity requirement)
• Conductive Components for Electronic Devices (contacts, connectors)
• Core Materials for Thermal Dissipation Modules